Acumen Capital Boosts Firan Technology Group (TSE:FTG) Price Target to C$12.00

Firan Technology Group (TSE:FTG) had its target price lifted by equities research analysts at Acumen Capital from C$11.50 to C$12.00 in a research report issued to clients and investors on Friday,BayStreet.CA reports. The brokerage presently has a “buy” rating on the stock. Acumen Capital’s price target suggests a potential upside of 50.38% from the company’s previous close.

Separately, Raymond James upgraded Firan Technology Group to a “moderate buy” rating in a report on Tuesday, April 8th.

Firan Technology Group Price Performance

Shares of FTG stock opened at C$7.98 on Friday. The firm has a market capitalization of C$201.12 million, a price-to-earnings ratio of 18.71 and a beta of 1.45. Firan Technology Group has a 12-month low of C$4.90 and a 12-month high of C$8.92. The company has a quick ratio of 1.53, a current ratio of 2.54 and a debt-to-equity ratio of 50.28. The firm has a fifty day moving average of C$7.57 and a 200-day moving average of C$7.35.

Insider Buying and Selling at Firan Technology Group

In other news, Director Mike Andrade acquired 10,000 shares of Firan Technology Group stock in a transaction dated Friday, April 11th. The stock was bought at an average cost of C$7.80 per share, with a total value of C$78,000.00. Also, Senior Officer James Crichton sold 10,400 shares of Firan Technology Group stock in a transaction that occurred on Monday, February 24th. The shares were sold at an average price of C$8.08, for a total value of C$84,032.00. Over the last quarter, insiders have purchased 15,100 shares of company stock valued at $116,548. 32.64% of the stock is currently owned by corporate insiders.

About Firan Technology Group

Firan Technology Group Corporation manufactures and sells aerospace and defense electronic products and subsystems in Canada, the United States, Asia, Europe, and rest of Americas. The company operates in two segments, FTG Circuits and FTG Aerospace. It offers semi additive process technologies, high density interconnect products, high temperature rigid flex printed, RF boards, thermal management, and rigid flex and assembly products.