Berenberg Bank Issues Pessimistic Forecast for Oxford Instruments (LON:OXIG) Stock Price

Oxford Instruments (LON:OXIGFree Report) had its price target cut by Berenberg Bank from GBX 2,925 ($37.64) to GBX 2,830 ($36.42) in a research note published on Tuesday, MarketBeat.com reports. They currently have a buy rating on the stock.

Separately, Shore Capital reiterated a “buy” rating on shares of Oxford Instruments in a research report on Wednesday, October 16th.

View Our Latest Analysis on Oxford Instruments

Oxford Instruments Stock Up 1.2 %

Shares of LON OXIG opened at GBX 2,110 ($27.15) on Tuesday. The company has a 50 day simple moving average of GBX 2,094.33 and a 200-day simple moving average of GBX 2,306.46. The company has a debt-to-equity ratio of 12.96, a current ratio of 1.64 and a quick ratio of 1.11. The company has a market capitalization of £1.22 billion, a P/E ratio of 2,453.49, a P/E/G ratio of -3.56 and a beta of 0.96. Oxford Instruments has a 1 year low of GBX 1,932 ($24.86) and a 1 year high of GBX 2,765 ($35.58).

Oxford Instruments Cuts Dividend

The business also recently disclosed a dividend, which will be paid on Friday, January 10th. Stockholders of record on Thursday, November 28th will be given a dividend of GBX 5.10 ($0.07) per share. This represents a dividend yield of 0.24%. The ex-dividend date is Thursday, November 28th. Oxford Instruments’s dividend payout ratio is currently 2,441.86%.

Oxford Instruments Company Profile

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Oxford Instruments plc provide scientific technology products and services for academic and commercial organizations worldwide. It operates through three segments: Materials & Characterisation, Research & Discovery, and Service & Healthcare. The company offers atomic force, electron, and Raman microscopy; deposition tools comprising plasma enhanced chemical vapour deposition, chemical vapour deposition, inductively coupled plasma chemical vapour deposition, atomic layer deposition, and ion beam deposition systems; and etch tools, including inductively coupled plasma etching, reactive ion etching, deep silicon etching, atomic layer etching, and ion beam etching systems.

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